Power chips are attached to outside circuits with packaging, and their efficiency depends upon the assistance of the product packaging. In high-power situations, power chips are usually packaged as power modules. Chip affiliation refers to the electric link on the top surface of the chip, which is usually light weight aluminum bonding wire in typical components. ^
Standard power component plan cross-section
Currently, industrial silicon carbide power components still primarily utilize the product packaging modern technology of this wire-bonded conventional silicon IGBT module. They face issues such as big high-frequency parasitical criteria, inadequate warm dissipation ability, low-temperature resistance, and inadequate insulation stamina, which limit using silicon carbide semiconductors. The screen of superb performance. In order to solve these issues and fully exploit the massive potential advantages of silicon carbide chips, many new product packaging modern technologies and solutions for silicon carbide power modules have emerged in the last few years.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have developed from gold cord bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually created from gold cords to copper cords, and the driving pressure is expense reduction; high-power tools have actually developed from aluminum cables (strips) to Cu Clips, and the driving pressure is to boost item performance. The greater the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a solid copper bridge soldered to solder to attach chips and pins. Compared with typical bonding product packaging methods, Cu Clip modern technology has the following advantages:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a particular degree, replaces the common cable bonding method between the chip and the pins. For that reason, a distinct package resistance value, higher current circulation, and far better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can completely conserve the expense of silver plating and bad silver plating.
3. The product appearance is completely constant with typical products and is mostly made use of in servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power products, and various other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding approach
Both eviction pad and the Source pad are clip-based. This bonding approach is extra pricey and complicated, yet it can attain better Rdson and much better thermal results.
( copper strip)
Copper sheet plus wire bonding approach
The resource pad makes use of a Clip approach, and the Gate makes use of a Wire technique. This bonding technique is somewhat less expensive than the all-copper bonding approach, conserving wafer area (relevant to extremely little entrance locations). The procedure is easier than the all-copper bonding approach and can obtain better Rdson and far better thermal result.
Distributor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper stone, please feel free to contact us and send an inquiry.
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